New SIA Map Highlights Broad U.S. Semiconductor Ecosystem
March 29, 2023 | SIAEstimated reading time: 1 minute
The semiconductor ecosystem in the United States is broad and diverse, as illustrated by SIA’s new U.S. Semiconductor Ecosystem Map, a first-of-its-kind tool that allows users to explore industry activities across the country, including nearly 500 locations in 42 states. This expansive ecosystem is comprised of semiconductor manufacturing, chip design, intellectual property and chip design software providers, semiconductor materials and manufacturing equipment, and research and development, including university R&D partners of the Semiconductor Research Corporation (SRC) and the National Nanotechnology Coordinated Infrastructure (NNCI).
Of particular note, the U.S. Semiconductor Ecosystem Map highlights announced company investments for new and expansion semiconductor ecosystem projects. These projects cover a range of activities needed to bolster the U.S. chip ecosystem, including new, expanded, or upgraded fabs in various semiconductor segments (e.g., advanced logic, memory, analog, and legacy chips), semiconductor equipment facilities, and facilities to produce key materials used in the chip manufacturing process. From the time the CHIPS Act was introduced in the Spring of 2020 through the months following its enactment in August 2022, companies in the semiconductor ecosystem announced dozens of projects to increase manufacturing capacity in the U.S. As of March 2023, some highlights of announcements spurred by the CHIPS Act include:
- Over $210 billion in new private investments announced across 19 states to increase domestic manufacturing capacity
- Over 50 new semiconductor ecosystem projects announced across the U.S., including the construction of new fabs, expansions of existing sites, and facilities that supply the materials and equipment used in chip manufacturing
- 44,000 new high-quality jobs announced in the semiconductor ecosystem as part of the new projects, which will support many more jobs throughout the broader U.S. economy
As the CHIPS Act incentives and R&D programs continue to be implemented, SIA’s U.S. Semiconductor Ecosystem Map will be updated to reflect the ever-growing domestic semiconductor footprint.
Suggested Items
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
SIA Commends CHIPS Act Incentives for Micron’s Manufacturing Projects in New York and Idaho
04/29/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Micron.
Real Time with… IPC APEX EXPO 2024: Tools, Training, and Trends in Manufacturing Engineering
04/25/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and Product Specialist Erik Bateham of Polar Instruments discuss Polar's latest technology, including their role in aiding manufacturing engineers. They highlight the advanced capabilities of Polar's tools and the critical role of signal integrity analysis, as well as the importance of accurate modeling in board manufacturing. Polar's unique training approach and demonstration contact details are also explored.
TTM Celebrates the Grand Opening of Its First Manufacturing Facility in Penang
04/25/2024 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), officially opened its first manufacturing plant in Penang, Malaysia with an investment of USD200 million (approximately RM958 million).
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.